SAN JOSE, CALIFORNIA May 20, 2010 – Apache Design Solutions, the technology leader in power integrity and noise closure for chip-package-systems (CPS) convergence, today announced that MoSys, Inc. (NASDAQ: MOSY), a leading provider of differentiated, high-density memory and high-speed interface (I/O) intellectual property (IP), has adopted Apache’s power and noise solutions, including RedHawk for SoC power integrity, Totem for custom IP validation and model generation, Sentinel for package design optimization, and PathFinder for electrostatic discharge (ESD) verification. MoSys is using Apache’s products in both their IP and their SoC businesses, allowing them to supply accurate and high performance models to their customers and deliver quality products to the market on time.

In February 2010, MoSys announced the broadening of its business from designing and delivering high-speed interface IP and high density memory IP to include the Bandwidth Engine™ family of ICs, which will combine MoSys’ patented 1T-SRAM® high-density embedded memory with its ultra high-speed 10 Gbps SerDes interface technology. MoSys uses Totem to perform accurate transistor-level power/ground noise analysis and to create Custom Macro Model (CMM) for SoC integration and validation. CMM enables hierarchical dynamic verification methodology and provides IP protection for delivery. In addition, RedHawk and Sentinel are used for chip-level power integrity, including integrated CMM and package parasitics. At the full-chip level, MoSys uses Apache’s latest product PathFinder, the ESD integrity solution, to ensure the robustness of their chip’s ESD protection mechanisms.

“Approximately one year ago, MoSys acquired Prism Circuits, a provider of world class, high-speed SerDes IP. Given that high-speed I/O interfaces are highly sensitive to power noise, we recognized that the traditional methods of using SPICE with scripts were inadequate,” said Sundari Mitra, executive vice-president of engineering at MoSys. “Using Totem, our team was able to quickly identify, and therefore resolve, real design issue in our SerDes circuit. The adoption of Apache’s products has helped MoSys sustain its leadership in IP and strengthen its competitiveness in the serial chip-to-chip communications markets.”

“MoSys’ patented 1T-SRAM IP is well-known in the industry for its quality,” said Dian Yang, senior vice president and general manager at Apache. “As MoSys broadens its product strategy, I am pleased that our solutions will contribute to their continued delivery of high quality IPs.”

About MoSys, Inc.
MoSys, Inc. (NASDAQ: MOSY) develops serial chip-to-chip communications solutions that deliver unparalleled bandwidth performance for next generation networking systems and advanced system-on-chip (SoC) designs. MoSys’ IP portfolio includes DDR3 PHYs and SerDes IP that support data rates from 1 – 11 Gigabits per second (Gbps) across a variety of standards. In addition, MoSys offers its flagship, patented 1T-SRAM(R) and 1T-Flash(R) memory cores, which offer a combination of high-density, low power consumption, high speed and low cost advantages for high-performance networking, computing, storage and consumer/graphics applications. MoSys IP is production-proven in more than 225 million devices. MoSys is headquartered in Sunnyvale, California. More information is available on MoSys’ website at http://www.mosys.com.

About Apache Design Solutions
Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence from RTL to sign-off. Apache’s innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog / custom IP, and System (IC package, SiP, PCB) while providing a co-analysis environment that integrates the SoC and system worlds. Apache’s products are adopted by 90% of the top 25 IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 200 employees and R&D centers and direct sales / support offices worldwide.

# # #

Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PathFinder, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. All other trademarks mentioned herein are the property of their respective owners.

1) Exhibition
• WHERE: Booth #51
• WHEN: Tuesday, May 4, 2010, 9:00 – 16:00

2) Open Forum Presentation on Apache’s solutions for chip-package-system convergence
• WHERE: Open Stage, Exhibition Floor
• WHEN: Tuesday, May 4, 2010, 13:00

3) Technical Presentation – Track D, Power Analysis and Low Power Design
• WHAT: “Comprehensive Low Power Design Analysis and Optimization: an RTL to GDS Approach.” A presentation outlining how designers can reduce cost, mitigate risk and improve time-to-market using an approach that considers CPS from RTL power analysis and reduction, to early stage prototyping and optimization, and through chip and package sign-off.
• WHO: Aveek Sarkar, vice president of product engineering and support; Ronen Stilkol, technical manager, Israel
• WHEN: Tuesday, May 4, 2010, 14:00

WHERE: ChipEx 2010, AVENUE convention and events center, Airport City, Israel

About Apache Design Solutions
Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence from RTL to sign-off. Apache’s innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog / custom IP, and System (IC package, SiP, PCB) while providing a co-analysis environment that integrates the SoC and system worlds. Apache’s products are adopted by 90% of the top 25 IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 200 employees and R&D centers and direct sales / support offices worldwide.

# # #

Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. All other trademarks mentioned herein are the property of their respective owners.

WINSTON-SALEM, N.C. – February 16, 2010 – Triad Semiconductor, Inc., the industry’s leading supplier of via-configurable mixed-signal ASICs, today announced another first: the first ARM® Cortex™-M0 processor combined with high-resolution, high-precision analog resources: 16-bit ADC and 12-bit DAC and uncommitted op-amps. Triad’s TSX1001, implemented on the Mocha-1™ platform, provides the performance and low-power 32-bit processing of the ARM Cortex-M0 processor combined with high-precision analog features. Mocha-1 is based on Triad’s silicon-proven via-configurable array (VCA) technology, which allows embedded system designers to customize processor, analog, and digital features with lower power consumption and greater system cost savings than last-generation ASIC solutions.

The TSX1001 is a single-chip, mixed-signal processor that an embedded product developer can use to measure sensors and control actuators in products such as accelerometers, automatic meter readers, temperature sensors, capacitive touch inputs, touch screens, medical sensors and other devices requiring analog and processor resources integrated into small spaces using small, low-power batteries.

“We are seeing a general trend toward portable, low-power embedded processing, which requires 32-bit processing performance as well as a great deal of precision analog integration,” said Reid Wender, vice president of marketing at Triad Semiconductor. “The TSX1001 is ideal for many applications and, since the TSX1001 is built on Triad’s Mocha-1 configurable array, designers are able to quickly and inexpensively build working prototypes to verify functionality before committing to a new mixed-signal Cortex-M0 SoC solution optimized for a specific application.”

The TSX1001 will be supported by industry standard embedded software tool flows such as the ARM® RealView® development suite. Triad has released the TSX1001 design to fabrication; engineering samples will be available in May 2010.

About Triad Semiconductor, Inc.
Triad Semiconductor, Inc., a privately held fabless semiconductor company with headquarters in Winston-Salem, North Carolina, develops, prototypes and produces mixed-signal ASICs. The company’s groundbreaking via-configurable array (VCA) technology delivers ASICs with silicon-proven analog and digital functions more quickly and at lower cost than traditional full-custom approaches. Triad’s single-mask, via-only routing cuts engineering effort and fabrication time, resulting in fast-turn prototypes and allowing design changes to be made at minimal cost. For more information, please visit www.triadsemi.com or call (336) 774-2150.

Mocha is a trademark of Triad Semiconductor, Inc. All other product or service names are the property of their respective owners. All rights reserved.

# # #

“Apache’s focus on key innovations for comprehensive power, noise, and reliability solutions is enabling our customers’ GHz, low power, single-chip initiatives,” stated Andrew Yang, CEO of Apache. “Apache will continue to execute based on technology vision, product delivery, and customer support.”

About Apache Design Solutions
Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence from RTL to sign-off. Apache’s innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog / custom IP, and System (IC package, SiP, PCB) while providing a co-analysis environment that integrates the SoC and system worlds. Apache’s products are adopted by 90% of the top 25 IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 200 employees and R&D centers and direct sales / support offices worldwide.

# # #

Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. All other trademarks mentioned herein are the property of their respective owners.

SAN JOSE, CALIFORNIA – April 13, 2010 – Apache Design Solutions, the technology leader in power integrity and noise closure for chip-package-systems (CPS) convergence, today announced that Aptina has adopted Apache’s RedHawk-NX and Totem-MMX solutions for accurate analysis, optimization, and sign-off of Aptina’s CMOS image sensors designs. Aptina selected Apache solutions based on the tools’ ability to simultaneously perform system-on-chip (SoC) and transistor-level analysis, the ease with which they fit into their existing flow, and their ability to prevent overdesign by identifying and reducing IR drop.

Image sensor arrays are very large and must maintain very low levels of noise for good quality image. Aptina will use Apache’s Totem-MMX, a transistor-level power / ground noise analysis and verification solution, to analyze and sign-off the huge analog sensor arrays which are implemented using custom-layout of transistors. The image sensor array is then compiled into accurate and efficient custom macro model (CMM) and imported to RedHawk-NX for a full-chip, mixed-signal dynamic power integrity simulation. The combination of Totem and RedHawk allows customers to consider the impact of analog transient supply currents on the digital logic of the SoC. Apache’s high-capacity integrated solution helps prevent power-related design failures.

“Our leading edge CMOS sensors require analysis and verification tools with super large capacity handling,” said Roger Panicacci, VP of Product Development, Aptina. “After benchmarking several tools, Apache clearly demonstrated the ability to accurately analyze our most advanced CMOS sensor designs with very complex logic structures. By adopting Apache’s power and noise platforms, we feel confident that our designs will maintain their competitive edge in performance and cost.”

“Aptina provides the leading edge CMOS sensor technology. Its applications can be found in all of the leading mobile phone and notebook computer brands, not to mention products ranging from digital and video cameras to medical and automotive applications,” said Craig Shirley, vice president of worldwide sales at Apache. “We’re pleased to have them place their confidence in our best-in-class power and noise integrity products.”

About Apache Design Solutions
Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence. Apache’s innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog / custom IP, and System (IC package, SiP, PCB), while providing a co-analysis environment that integrates the SoC and System worlds. From early-stage to sign-off, Apache’s products are adopted by 95% of the top 20 IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 200 employees and R&D centers and direct sales / support offices worldwide.

About Aptina
Aptina is a global provider of CMOS imaging solutions with a growing portfolio of products that can be found in all leading mobile phone and notebook computer brands as well as a wide range of products for digital and video cameras, surveillance, medical, automotive and industrial applications, video conferencing, barcode scanners, toys, and gaming. Aptina enables Imaging Everywhere™ and continually drives innovation in the market as seen with the introduction of the first 14MP CMOS image sensor for point-and-shoot and hybrid cameras (MT9F001), and the industry’s first 5MP SOC with ¼” format (MT9P111). Aptina is a privately held company with investors that include Riverwood Capital, TPG Capital and Micron Technology. For additional information on Aptina, visit www.aptina.com.

Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. Aptina is a trademark of Aptina Imaging Corporation. All other trademarks mentioned herein are the property of their respective owners.

Totem-SE addresses the challenges associated with global coupling of power/ground noise, substrate noise, and package/PCB capacitive and inductive noise in analog and mixed-signal designs. It incorporates transistor-level noise injection, power/ground mesh and substrate network extraction, package/PCB modeling, dynamic analysis, and design debug in a single-flow environment. Delivering measurement-correlated accuracy and the capacity to handle standalone DRAM, Flash, and CMOS image sensors, Totem-SE enables designers to perform early stage prototyping, chip sign-off, and post-silicon debug.

”We are extremely pleased to once again be recognized by this prestigious award,” said Andrew Yang, CEO Apache Design Solutions. RedHawk, our flagship power integrity solution, was the winner in 2004 and Sentinel-CPM, the industry standard die modeling for Chip-Package-System, was the winner in 2008. This year’s nomination for Totem-SE demonstrates Apache’s commitment to continuously innovate and deliver solutions that meet the challenges faced by designers.”

During the months of February and March, EDN’s worldwide audience of electronics engineers and engineering managers will use an online ballot to select the ultimate winners from among the finalists. EDN’s editorial staff will also take part in determining the final winners. We encourage you to visit www.EDN.com/innovation20 to cast your vote for your favorite finalist. Winners will be announced at a reception and awards ceremony on April 26, 2010 in San Jose, CA.

About EDN and EDN.com
EDN serves the vital information needs of design engineers and engineering managers worldwide. EDN.com delivers a three-dimensional view of the electronics industry via news coverage, strategic business information, and in-depth technical content. (www.edn.com) EDN is published by Reed Business Information (www.reedbusiness.com/us), the largest business-to business publisher in the U.S. and a member of the Reed Elsevier Group plc (NYSE: RUK and ENL) – a world-leading publisher and information provider.

About Apache Design Solutions
Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence. Apache’s innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog / custom IP, and System (IC package, SiP, PCB) while providing a co-analysis environment that integrates the SoC and System worlds. From early-stage to sign-off, Apache’s products are adopted by 95% of the top 20 IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 200 employees and R&D centers and direct sales / support offices worldwide.

Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. All other trademarks mentioned herein are the property of their respective owners.

# # #

WINSTON-SALEM, N.C. – February 16, 2010 – Triad Semiconductor, Inc., the industry’s leading supplier of via-configurable mixed-signal ASICs, today announced another first: the first ARM® Cortex™-M0 processor combined with high-resolution, high-precision analog resources: 16-bit ADC and 12-bit DAC and uncommitted op-amps. Triad’s TSX1001, implemented on the Mocha-1™ platform, provides the performance and low-power 32-bit processing of the ARM Cortex-M0 processor combined with high-precision analog features. Mocha-1 is based on Triad’s silicon-proven via-configurable array (VCA) technology, which allows embedded system designers to customize processor, analog, and digital features with lower power consumption and greater system cost savings than last-generation ASIC solutions.

The TSX1001 is a single-chip, mixed-signal processor that an embedded product developer can use to measure sensors and control actuators in products such as accelerometers, automatic meter readers, temperature sensors, capacitive touch inputs, touch screens, medical sensors and other devices requiring analog and processor resources integrated into small spaces using small, low-power batteries.

“We are seeing a general trend toward portable, low-power embedded processing, which requires 32-bit processing performance as well as a great deal of precision analog integration,” said Reid Wender, vice president of marketing at Triad Semiconductor. “The TSX1001 is ideal for many applications and, since the TSX1001 is built on Triad’s Mocha-1 configurable array, designers are able to quickly and inexpensively build working prototypes to verify functionality before committing to a new mixed-signal Cortex-M0 SoC solution optimized for a specific application.”

The TSX1001 will be supported by industry standard embedded software tool flows such as the ARM® RealView® development suite. Triad has released the TSX1001 design to fabrication; engineering samples will be available in May 2010.

About Triad Semiconductor, Inc.
Triad Semiconductor, Inc., a privately held fabless semiconductor company with headquarters in Winston-Salem, North Carolina, develops, prototypes and produces mixed-signal ASICs. The company’s groundbreaking via-configurable array (VCA) technology delivers ASICs with silicon-proven analog and digital functions more quickly and at lower cost than traditional full-custom approaches. Triad’s single-mask, via-only routing cuts engineering effort and fabrication time, resulting in fast-turn prototypes and allowing design changes to be made at minimal cost. For more information, please visit www.triadsemi.com or call (336) 774-2150.

Mocha is a trademark of Triad Semiconductor, Inc. All other product or service names are the property of their respective owners. All rights reserved.

# # #

SAN JOSE, CALIFORNIA – February 9, 2010 – Apache Design Solutions, the technology leader in power and noise integrity for chip-package-systems (CPS) convergence, today announced that PLX Technology, Inc. (NASDAQ: PLXT) has adopted Apache’s RedHawk-NX and PakSi-E solutions to improve their power grid design. PLX Technology is a leading global supplier of software-enriched silicon connectivity solutions for the enterprise PCI Express and consumer storage markets.

PLX chose RedHawk-NX and PakSi-E for their ability to provide accurate analysis of the power delivery network and to perform exploration of various design scenarios for optimal results. RedHawk-NX, the industry’s leading full-chip dynamic power sign-off solution, was able to identify the location of power weaknesses in the design. It also allowed PLX to determine optimal fixes, including package selection, pad placement location and pad sizing through its “what-if” analysis capabilities. PakSi-E, Apache’s IC package and system-in-package (SiP) 3D extraction and analysis tool, performs full package extraction and provides package parasitics for accurate SoC analysis.

“We need to constantly improve our power grid design and analysis methodology especially at 40nm and below with lower operating voltages,” said Vijay Meduri, vice president of engineering at PLX Technology. “Apache’s ability to handle the design size and complexity we anticipate will ensure us that our power network will meet the required specification and function properly.”

“PLX Technology’s semiconductor-based solutions are known for their high quality interoperability and performance,” said Craig Shirley, vice president of worldwide sales at Apache. “We are pleased to be able to help PLX with their power analysis and optimization, enabling them to mitigate risk and reduce cost.”

About Apache Design Solutions
Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence. Apache’s innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog / custom IP, and System (IC package, SiP, PCB), while providing a co-analysis environment that integrates the SoC and System worlds. From early-stage to sign-off, Apache’s products are adopted by 95% of the top 20 IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 200 employees and R&D centers and direct sales / support offices worldwide.

# # #

Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. All other trademarks mentioned herein are the property of their respective owners.

SAN JOSE, CALIFORNIA – January 26, 2009 – Apache Design Solutions, the technology leader in power and noise integrity for chip-package-systems (CPS) convergence, is sponsoring a workshop at DesignCon 2010 to facilitate industry-wide discussion on the challenges, methodologies, and techniques required for chip-package-systems (CPS) convergence. The workshop, entitled “Practical Methodologies for Power/Signal Integrity of Chip-Package-Board Designs,” will be held from 9am to noon on Thursday, February 4th in the Santa Clara Convention Center.

As technologies evolve to meet performance, area, and cost demands, designers are faced with several challenges that are becoming increasingly critical to the success of IC and system designs. To address these chip-package-board challenges requires integrated analysis and verification solutions but there is a lack of tools and methodologies available in the industry today.

In this workshop, representatives from key semiconductor and system design companies will come together to discuss their understanding of power and signal integrity challenges across the global system. They will share their insights on techniques and practical methods the industry is using to address the CPS requirements and what vendors can do to develop and deliver solutions that meet their needs. The workshop will drive an open forum for semiconductor and system companies to exchange ideas and information that will help define the contents of future technologies for chip and package modeling and system level verification for power and signal integrity.

As Larry Smith, signal and power integrity architect from Altera Corporation, says, “PDN design and performance is a system-level problem involving the die, package, and PCB. The industry is in need of tools and concepts to address this challenging issue. We appreciate Apache taking the initiative to drive and facilitate this forum for discussion at DesignCon.”

“The Practical Methodologies for Power/Signal Integrity of Chip-Package-Board Designs workshop in this year’s program is representative of the overall objective of the DesignCon event, which spans the electronic design disciplines from the chip through boards and systems,” commented DesignCon program director Barry Sullivan. “We look forward to the unique take each participant will share with the DesignCon audience next month.”

For additional detail, or to listen to a podcast preview, please go to
http://www.designcon.com/2010/attendees/th_th1/index.asp

Apache Design is offering a free Exhibits PLUS pass to DesignCon (which allows entry to the exhibition, keynote addresses, technical panels, business forum sessions, and more) to workshop attendees. For more information, see http://www.apache-da.com/apache-da/Home/NewsandEvents/Events.html

About Apache Design Solutions
Apache delivers the industry’s leading global power and noise analyses platform solutions for Chip-Package-System convergence. Apache’s innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog / custom IP, and System (IC package, SiP, PCB), while providing a co-analysis environment that integrates the SoC and System worlds. From early-stage to sign-off, Apache’s products are adopted by 95% of the top 20 IDM, fabless semiconductor, and foundries for cost reduction, risk mitigation, and time-to-market improvements. Apache is a global company with over 200 employees and R&D centers and direct sales / support offices worldwide.

# # #

Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. All other trademarks mentioned herein are the property of their respective owners.

SAN JOSE, CALIFORNIA – January 25, 2010– Apache Design Solutions, the technology leader in power and noise integrity for chip-package-systems (CPS) convergence, today announced that the company will be participating at the upcoming Electronic Design and Solution Fair 2010 (EDSFair2010) in Yokohama, Japan, January 28 -29, 2010. Apache Design Solutions will be demonstrating the company’s comprehensive power and noise solutions from RTL to silicon, digital to analog, and chip to package and system, in stand #405.

WHO: Apache Design Solutions
WHAT: Electronic Design and Solution Fair 2010
WHERE: Pacifico Yokohama Exhibition Hall, Stand #405.
WHEN: Thursday, January 28 & Friday, January 29, 2010, 10:00AM to 6:00PM

Apache’s General Manager and Senior Vice President of RTL Business Unit, Vic Kulkarni will also be presenting at the Low Power Design Session that will highlight current and future low power design issues and the available solutions and techniques.

WHAT: Session 4 | Low Power Design Session
WHERE: Pacifico Yokohama Exhibition Hall, Special Presentation Stage
WHEN: Friday, January 29, 2010, 11:50 am – 12:50 pm

For more information about EDSFair2010, please visit http://www.edsfair.com/e/.

About Apache Design Solutions
Apache delivers the industry’s leading global power and noise analyses platform solutions for chip-package-system convergence. Apache’s innovative platforms address the unique power and noise challenges associated with specific design domains such as SoC (digital), analog / custom IP (intellectual property), and system (IC package, SiP, PCB), while providing a co-analysis environment that integrates the SoC and system worlds. From early-stage to sign-off, Apache’s products are adopted by 95% of the top 20 IDM, fabless semiconductor and foundries for cost reduction, risk mitigation and time-to-market improvements. Apache is a global company with over 200 employees and R&D centers and direct sales / support offices worldwide.
# # #
Apache Design Solutions, CMM, CPM, CoolTime, Columbus, NSPICE, RedHawk, PakSI-E, PsiWinder, PowerArtist, PowerTheater, Sahara, Sentinel, Totem, and Vectorless Dynamic are trademarks of Apache Design Solutions, Inc. All other trademarks mentioned herein are the property of their respective owners.