SoC

This tag is associated with 14 posts

Apache’s Totem-SE Named a Finalist in EDN’S 20th Annual Innovations Awards Competition

SAN JOSE, Calif. – March 1, 2010 - Apache Design Solutions, the technology leader in power integrity and noise closure for chip-package-systems (CPS) convergence, today announced that Totem-SE, the industry’s first fully integrated power and noise analysis platform for analog, mixed-signal, memory, and high-speed I/O designs, has been selected from hundreds of nominations to be [...]
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Triad Semiconductor Announces First Mixed-signal ARM® Cortex™-M0 Processor with 16-bit ADC and 12-bit DAC

Comprehensive, low power TSX1001 combines precision analog with 32-bit processing WINSTON-SALEM, N.C. – February 16, 2010 - Triad Semiconductor, Inc., the industry’s leading supplier of via-configurable mixed-signal ASICs, today announced another first: the first ARM® Cortex™-M0 processor combined with high-resolution, high-precision analog resources: 16-bit ADC and 12-bit DAC and uncommitted op-amps. Triad’s TSX1001, implemented on [...]
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Apache Design Solutions’ Power Analysis and Optimization Solutions Adopted by PLX Technology

RedHawk and PakSi-E deployed as the power analysis, sign-off, and optimization solutions for leading network storage designs SAN JOSE, CALIFORNIA – February 9, 2010 – Apache Design Solutions, the technology leader in power and noise integrity for chip-package-systems (CPS) convergence, today announced that PLX Technology, Inc. (NASDAQ: PLXT) has adopted Apache’s RedHawk-NX and PakSi-E solutions to [...]
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Chip-Package-Systems Convergence Workshop to be Held at DesignCon 2010

Key semiconductor and system design houses to share insights and practical solutions SAN JOSE, CALIFORNIA – January 26, 2009 – Apache Design Solutions, the technology leader in power and noise integrity for chip-package-systems (CPS) convergence, is sponsoring a workshop at DesignCon 2010 to facilitate industry-wide discussion on the challenges, methodologies, and techniques required for chip-package-systems (CPS) [...]
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Apache Design Solutions to Participate at the Electronic Design and Solutions Fair 2010

Key Executive to present at the Low Power Design Session highlighting the latest solutions for low power designs SAN JOSE, CALIFORNIA – January 25, 2010– Apache Design Solutions, the technology leader in power and noise integrity for chip-package-systems (CPS) convergence, today announced that the company will be participating at the upcoming Electronic Design and Solution Fair [...]
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Apache Design Solutions Closes 2009 with Record Quarter and Record Year

SAN JOSE, Calif. – January 21, 2010 – Apache Design Solutions, the technology leader in power and noise solutions for chip-package-systems (CPS) convergence, today announced that the company has achieved record bookings and revenue in Q4, while maintaining profitability. In addition, the company had double digit growth from 2008 to 2009 and became the market [...]
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Apache’s Power and Noise Solutions for Chip-Package-System Convergence Adopted by Sigma Designs for Digital Media SoCs

Contract reflects successful integration of Apache and Sequence Design, now delivering complete power and noise solutions from RTL to GDS SAN JOSE, CALIFORNIA – January 20, 2010 – Apache Design Solutions, the technology leader in power and noise solutions for chip-package-systems (CPS) convergence, today announced that Sigma Designs, Inc. (Nasdaq: SIGM), a leader in digital media [...]
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BDTI Certified Results Show PICO High Level Synthesis Platform Produces Quality of Results Comparable to Hand-coded RTL

Synfora PICO High Level Synthesis Platform Certified in Berkeley Design Technology’s New Tool Certification Program MOUNTAIN VIEW, Calif. – January 18, 2010 – The PICO High Level Synthesis Platform from Synfora, Inc., the premier provider of high level synthesis tools for integrated circuit and system designers, has achieved certification in Berkeley Design Technology, Inc.’s (BDTI’s) [...]
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Triad Semiconductor Announces Availability of World’s First Configurable ARM® Cortex™-M0 Mixed-signal ASIC Solution

WINSTON-SALEM, N.C. – January 12, 2010 - Triad Semiconductor Inc., the industry’s leading supplier of via-configurable mixed-signal ASICs, today announced the first system-on-chip (SoC) to integrate the world-class ARM® Cortex™-M0 with the via-configurable analog and digital functions needed to rapidly and inexpensively deliver embedded mixed-signal solutions. Triad’s Mocha-1™ array provides access to ARM standardized 32-bit [...]
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Triad Semiconductor and Z-Focus to Demonstrate the World’s First Software-based Real-time Single-mode Bluetooth Low Energy Data Transfer at ARM Techcon3

Triad Semiconductor and Z-Focus Technology Group will demonstrate the world’s first software-based, real-time Bluetooth Low Energy (BLE) data transfer at ARM Techcon3 in Santa Clara, California from October 21-22, 2009. The demonstration, based on the BLE v0.9 prototyping specification, will wirelessly stream real time digitized signals from Triad’s new Mocha development system to a PC display.
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