Hello everyone and welcome to my blog!

I will use this space to share my experiences working here at Apache in bringing technologies that help our customers make their designs more likely to succeed the first time around and at the lowest unit cost looking at chip design holistically considering the package it goes in and the board it sits on. I will also look from the package and board designers point of view about how the die needs to be designed and factored in to make cheaper, more efficient package and board layouts.

Looking forward to hearing from others also.